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Additive manufacturing, new routes for saving materials
Rheology and Conduction of Functional Polymers for Embedded Electronics in 3D/4D Additive Manufacturing
This PhD project, conducted on the MAPP platform (CEA-Metz), focuses on the development of additive manufacturing (3D/4D) processes for the integration of smart materials. The aim is to overcome the limitations of traditional planar electronic architectures (PCBs, wafers) integration by enabling the direct-to-shape printing of electronic functions within 3D parts performed by Fused Deposition Modeling...