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PostDoc
Design of in-memory high-dimensional-computing system
Conventional von Neumann architecture faces many challenges in dealing with data-intensive artificial intelligence tasks efficiently due to huge amounts of data movement between physically separated data computing and storage units. Novel computing-in-memory (CIM) architecture implements data processing and storage in the same place, and thus can be much more energy-efficient than state-of-the-art von Neumann architecture....
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PostDoc
Development of innovative metal contacts for 2D-material field-effect-transistors
Further scaling of Si-based devices below 10nm gate length is becoming challenging due to the control of thin channel thickness. For gate length smaller than 10nm, sub-5nm thick Si channel is required. However, the process-induced Si consumption and the reduction of carrier mobility in ultrathin Si layer can limit the channel thickness scaling. Today, the...
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PostDoc
Optimization of Li metal/electrolyte for the next generation of all-solid-state battery
CEA Tech Nouvelle-Aquitaine, created in 2013, set up a new laboratory, since more than two years, focused on both the development of materials and the high throughput screening to accelerate the discovery of materials for the next generations of Li-ion batteries. For that, the CEA Tech Nouvelle-Aquitaine acquires different vacuum deposition equipment (sputtering, evaporation, atomic...
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PostDoc
Quantum dot auto-tuning assisted by physics-informed neural networks
Quantum computers hold great promise for advancing science, technology, and society by solving problems beyond classical computersapos; capabilities. One of the most promising quantum bit (qubit) technologies are spin qubits, based on quantum dots (QDs) that leverage the great maturity and scalability of semiconductor technologies. However, scaling up the number of spin qubits requires overcoming...
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PostDoc
Advanced reconstruction methods for cryo-electron tomography of biological samples
Cryo-electron tomography (CET) is a powerful technique for the 3D structural analysis of biological samples in their near-native state. CET has seen remarkable advances in instrumentation in the last decade but the classical weighted back-projection (WBP) remains by far the standard CET reconstruction method. Due to radiation damage and the limited tilt range within the...
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phD
High-throughput experimentation applied to battery materials
High throughput screening, which has been used for many years in the pharmaceutical field, is emerging as an effective method for accelerating materials discovery and as a new tool for elucidating composition-structure-functional property relationships. It is based on the rapid combinatorial synthesis of a large number of samples of different compositions, combined with rapid and...
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phD
Design and fabrication of neuromorphic circuit based on lithium-iontronics devices
Neural Networks (NNs) are inspired by the brain’s computational and communication processes to efficiently address tasks such as data analytics, real time adaptive signal processing, and biological system modelling. However, hardware limitations are currently the primary obstacle to widespread adoption. To address this, a new type of circuit architecture called quot;neuromorphic circuitquot; is emerging. These...
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phD
Complex 3D structuring based on DNA origami
The rapid evolution of new technologies, such as autonomous cars and renewable energy, requires the development of increasingly complex structures. To achieve this, many surface patterning techniques are available today. In microelectronics, optical lithography is the standard method for creating micro- and nanometric patterns. However, it remains limited in terms of the diversity of shapes...
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phD
Fracture dynamics in crystalline layer transfer technology
Smart Cut™ is a technology discovered at CEA and now industrially used for the manufacture of advanced substrates for electronics. However, the physical phenomena involved are still the focus of numerous studies at CEA. In Smart Cut™, a thin material layer is transferred from one wafer to another using a key fracture annealing step upon...
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phD
Self Forming Barrier Materials for Advanced BEOL Interconnects
Context : As semiconductor technology scales down to 10 nm and below, Back End of Line (BEOL) scaling presents challenges, particularly in maintaining the integrity of copper interconnects, where line/via resistance and copper fill are key issues. Copper (Cu) interconnections must resist diffusion and delamination while maintaining optimal conductivity. In the traditional Cu damascene process,...
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phD
Impact of plasma activation on reliability of Cu/SiO2 hybrid bonding integrations
In recent years, CEA-LETI emerged as a leading force in the development of advanced microelectronic manufacturing processes. A key focus has been on wafer-to-wafer Cu/SiO2 hybrid bonding (HB) process, an emerging technology increasingly employed for producing compact, high performance and multifunctional devices. Before bonding, a crucial surface activation step is necessary to enhance the mechanical...
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phD
Plasma Etching development for the advanced nodes using SADP techniques
The miniaturization of the electronics components involves the development of new processes. Indeed, the 193nm immersion lithography alone does not permit anymore to achieve the dimensional requirements of the most advanced technological nodes (=10nm). Since the last 10 years, multi-patterning techniques have been developed to overcome the i193nm lithography limitations. Herein, we will study the...
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phD
TeraHertz Landau emission in HgTe/CdTe topological quantum wells
Quantum well heterostructures of HgTe/CdTe are known as topological insulators. They inherit very peculiar electronic properties. One of them is the ability of producing TeraHertz emission from inter-Landau energy level optical transitions. These transitions can be envisioned to lead to coherent optical sources in spectral range where they are basically absent. The PhD Thesis consists...
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phD
MOCVD growth of 2D ferroelectric In2Se3 films for high density, low consumption nonvolatile memories
Room temperature ferroelectric thin films are the key element of high density, low consumption nonvolatile memories. However, with the further miniaturization of the electronics devices beyond the Moore’s law, conventional ferroelectrics suffer great challenge arising from the critical thickness effect, where the ferroelectricity is unstable if the film thickness is reduced to nanometer or single...
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phD
Sub-10nm CMOS performances assessment by co-optimization of lithography and design
While developing and introducing new technologies (ex. FDSOI 10nm CMOS), design rules (DRM) are the guidelines used to ensure that a chip design can be reliably fabricated. These rules govern the physical dimensions and spacing of various features used by the designer in the chip layout. They translate both device electrical constraints and manufacturing processes...
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phD
Study of grayscale photoresists and lithography process optimizations for submicron optical applications
Grayscale lithography process has been used for several years to obtain complex tridimensional structures on semiconductors substrates. This process is particularly adapted for optical and opto-electronics applications. CEA-LETI has developed a strong expertise on I-line (365nm) grayscale lithography, and is now willing to expand its capabilities and explore grayscale process with DUV (248nm and 193nm)...
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phD
SCOamp;FE ALD materials for FeFET transistors
Ferroelectric Field Effect Transistors FeFET is a valuable high-density memory component suitable for 3D DRAM. FeFET concept combines oxide semiconductors SCO as canal material and ferroelectric metal oxides FE as transistor gate [2, 3]. Atomic layer deposition ALD of SCO and FE materials at ultrathin thickness level (lt;10 nm) and low temperature (lt;300°C) are highly...
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phD
Direct metal etch mechanisms study for the BEOL of ultimate SOI nodes
The topic fits into the deployment of silicon technologies at the European level (European chips act), led by CEA-Leti. The focus will be on providing advanced technological building blocks for electrical routing (Back End of Line) of logic and analog devices. The development of increasingly high-performance circuits requires interconnections with more aggressive dimensions. The use...
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phD
ALD materials for FE and AFE capacitances
Ultrathin HfO2-based materials are regarded as promising candidates for embedded non-volatile memory (eNVM) and logic devices. The CEA-LETI has a leadership position in the field of BEOL-FeRAM memories ultra-low consumption (lt;100fj/bit) at low voltage (lt;1V). In this context, the developments expected in this thesis aim to evaluate the impact of HfO2-based ferroelectric FE and antiferroelectric...
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phD
Advanced Surface Analysis of Ferroelectrics for memory applications
CEA-Leti has a robust track record in memory technology. This PhD project aims to contribute to the development of HfO2-based ferroelectric devices. One of the major challenges in this field is to stabilize the orthorhombic phase while reducing film thickness and thermal budget. To gain a deeper understanding of the underlying mechanisms, a novel sample...
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phD
Low temperature selective epitaxial growth of SiGe(:B) for pMOS FD-SOI transistors
As silicon technologies for microelectronics continue to evolve, processes involved in device manufacturing need to be optimized. More specifically, epitaxy, a crystal growth technique, is being used to fabricate 10 nm technological node FD-SOI (Fully Depleted-Silicon On Insulator) transistors as part of CEA-Letiapos;s NextGen project. Doped and undoped Si and SiGe semiconductor epitaxy is being...
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phD
Optimisation of advanced mask design for sub-micrometer 3D lithography
With the advancement of opto-electronic technology, 3D patterns with sub micrometer dimensions are more and more integrated in the device, especially on imaging and AR/VR systems. To fabricate such 3D structures using standard lithography technique requires numerous process steps: multiple lithography and pattern transfer, which is time and resource consuming. With optical grayscale lithography, such...
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phD
Study and evaluation of silicon technology capacities for applications in infrared bolometry
Microbolometers currently represent the dominant technology for the realization of uncooled infrared thermal detectors. These detectors are commonly used in the fields of thermography and surveillance. However, the microbolometer market is expected to grow explosively in the coming years, particularly with their integration into automobiles and the proliferation of connected devices. The CEA Leti LI2T,...
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phD
Topologic optimization of µLEDapos;s optical performance
The performance of micro-LEDs (µLEDs) is crucial for micro-displays, a field of expertise at the LITE laboratory within CEA-LETI. However, simulating these components is complex and computationally expensive due to the incoherent nature of light sources and the involved geometries. This limits the ability to effectively explore multi-parameter design spaces. This thesis proposes to develop...
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phD
Development of multiplexed photon sources for quantum technologies
Quantum information technologies offers several promises in domains such as computation or secured communications. There is a wide variety of technologies available, including photonic qubits. The latter are robust against decoherence and are particularly interesting for quantum communications applications, even at room temperature. They also offers an alternative to other qubits technologies for quantum computing....
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phD
Water at the hydrophilic direct bonding interface
The microelectronics industry is making increasing use of hydrophilic direct bonding technology to produce innovative substrates and components. CEA LETIapos;s teams have been leaders in this field for over 20 years, offering scientific and technological studies on the subject. The key role of water at the bonding interface can be newly understood thanks to a...
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phD
Study of 3D pattern etch mechanisms into inorganic layers for optoelectronic applications
Optoelectronic devices such as CMOS Image Sensors (CIS) require the realization of 3D structures, convex microlenses, in order to focus photons towards the photodiodes defining the pixels. These optical elements are mandatory for the device efficiency. Their shape and dimension are critical for device performances. In the same way, devices based on diffractive optic and...
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phD
Increasing the electrothermal robustness of new SiC devices
Silicon Carbide (SiC) is a semiconductor with superior intrinsic properties than Silicon for high temperature and high power electronics applications. SiC devices are expected to be extensively used in the electrification transition and novel energy management applications. To fully exploit the SiC superior properties, the future semiconductor devices will be used under extreme biasing and...
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Fixed term contract
Ingénieur Maintenance d'équipements de Microélectronique - CDD H/F
Nous rejoindre, pour faire quoi ? Dans le cadre d'un projet européen, vous jouerez un rôle clé en tant qu’ingénieur maintenance responsable de l'installation, de la mise en service, de la maintenance et de la pérennisation des nouveaux équipements de dépôt pour la ligne 300 mm. Vos missions principales incluront : Préparation, configuration, installation et...
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PostDoc
DTCO for RF amp; mmW Applications:Focus on Homogeneous amp; Heterogeneous Chiplet Hybrid Bonding Challenge
In recent years, there have been numerous technological advancements in silicon-based semiconductors. However, the limits in terms of frequency performance and power seem to have been reached, requiring the development of new type III-V devices (such as InP and GaN) that are faster, more powerful and well adapted for new RF mmW applications. For reasons...
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Fixed term contract
Ingénieur Design Rule Manual H/F
Lorsqu’une technologie atteint un niveau de maturité R&D élevé (pré-industrialisation), il est indispensable de fiabiliser son processus de fabrication. L’un des facteurs clés de réussite consiste à définir précisément les règles de dessins (Design Rules) qui vont permettre 1) d’assurer un haut niveau de rendement lors de la fabrication et 2) d’obtenir une densité d’intégration...
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Fixed term contract
Modeling and Simulation of Ferroelectric Devices for Energy Efficient Systems
The Simulation and Modeling Laboratory is involved in the development of new technologies for embedded memories. This laboratory collaborates with the technology integration, characterization, and integrated circuit design teams. Today, data production is growing exponentially due to the widespread use of connected objects, intelligent systems, and the rapid development of artificial intelligence. Memories, electronic components...
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phD
Towards eco innovative, sustainable and reliable piezoelectric technology
Are you looking for a Phd position at the intersection of eco-innovation and high-tech? This subject is for you! You will participate in efforts aimed at reducing the environmental footprint of piezoelectric (PZE) technology applied to micro actuators and sensors, while maintaining optimal levels of electrical performance and reliability. Currently PZE technology primarily relies on...
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phD
Selective epitaxial Regrowth for extended Base contact in High-Performance Antimonide-based HBT Transistors
With the rapid expansion of wireless networks and the imminent arrival of 6G, the need for highly efficient communication systems has never been more critical. In this context, frequencies beyond 140 GHz emerge as a key frontier, where cutting-edge technologies leverage advanced semiconductors like InP, delivering unmatched performance beyond what SiGe solutions can achieve. However,...
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phD
Simulation and characterization of integrated structures during and after the millisecond laser annealing step
Laser annealing processes are now used in a large range of applications in most advanced microelectronics technologies. Whether in the context of advanced planar CMOS components or 3D integration technologies, the specific characteristics of laser annealing enables to reach very high temperatures in very short times, at die scale, and to work in conditions out...
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Fixed term contract
CDD - Ingénieur - Caractérisation avancée de détecteurs H/F
Le Laboratoire d'Imagerie infrarouge (LIR) du CEA-LETI (#Display) recherche un ingénieur électronique dans le domaine de la détection infrarouge pour participer aux développements d'une nouvelle génération de détecteurs infrarouge pour les applications d'optique quantique. Nous vous proposons d’intégrer un environnement de recherche unique pour une expérience sur une thématique à la pointe de l’innovation : le...
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Fixed term contract
Ingénieur procédés lithographie eBeam H/F
Nous rejoindre, pour quoi faire ? Chez nous, vous testez, vous innovez, vous transformez les idées en résultats concrets. Avec un accès privilégié à la salle blanche Leti 200 et 300mm, dans un environnement R&D à forte composante industrielle, vous rejoindrez un laboratoire multidisciplinaire de 20 personnes qui place l’entraide au cœur de la réussite...
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phD
Vertical GaN power devices development using localized epitaxy
This PhD offers a unique opportunity to enhance your skills in GaN power devices and develop cutting-edge architectures. You’ll work alongside a multidisciplinary team specializing in materials engineering, characterization, device simulation, and electrical measurements. If you’re eager to innovate, expand your knowledge, and tackle state-of-the-art challenges, this position is a valuable asset to your career!...
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phD
Innovative cooling solutions for 2.5D and 3D electronic systems
This thrilling PhD position invites you to dive into the groundbreaking field of 2T0C (Two-Transistor, Zero-Capacitor) BEOL FET (Back-End-of-Line Field-Effect Transistor) based neurons and synapses, a revolutionary approach poised to transform neuromorphic computing. As a PhD student, you will be at the forefront of research that bridges advanced semiconductor technology with brain-inspired architectures, exploring how...
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phD
Field Effect Transistor with Oxide Semiconductor Channel: Multi-Level Synaptic Functions and Analog Neurons
This thrilling PhD position invites you to dive into the groundbreaking field of 2T0C (Two-Transistor, Zero-Capacitor) BEOL FET (Back-End-of-Line Field-Effect Transistor) based neurons and synapses, a revolutionary approach poised to transform neuromorphic computing. As a PhD student, you will be at the forefront of research that bridges advanced semiconductor technology with brain-inspired architectures, exploring how...
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phD
Bayesian Neural Networks with Ferroelectric Memory Field-Effect Transistors (FeMFETs)
Artificial Intelligence (AI) increasingly powers safety-critical systems that demand robust, energy-efficient computation, often in environments marked by data scarcity and uncertainty. However, conventional AI approaches struggle to quantify confidence in their predictions, making them prone to unreliable or unsafe decisions. This thesis contributes to the emerging field of Bayesian electronics, which exploits the intrinsic randomness...
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phD
In situ study of the impact of the electric field on the properties of chalcogenide materials
Chalcogenide materials (PCM, OTS, NL, TE, FESO, etc.) are the basis of the most innovative concepts in microelectronics, from PCM memories to the new neuromorphic and spinorbitronic devices (FESO, SOT-RAM, etc.). Part of their operation relies on out-of-equilibrium physics induced by the electronic excitation resulting from the application of an intense electric field. The aim...
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phD
Towards a low-resistive base contact for the InP-HBT transistor
Join CEA LETI for an exciting technological journey! Immerse yourself in the world of III V based transistors integrated on compatible CMOS circuits for 6 G future communications This thesis offers the chance to work on a ambitious project, with potential to continue into a thesis If youapos;re curious, innovative, and eager for a challenge,...
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phD
Development of ultra-high-resolution magnetic microcalorimeters for isotopic analysis of actinides by X-ray and gamma-ray spectrometry
The PhD project focuses on the development of ultra-high-resolution magnetic microcalorimeters (MMCs) to improve the isotopic analysis of actinides (uranium, plutonium) by X- and gamma-ray spectrometry around 100 keV. This type of analysis, which is essential for the nuclear fuel cycle and non-proliferation efforts, traditionally relies on HPGe detectors, whose limited energy resolution constrains measurement...
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phD
In-depth electrical and material characterization of low-K spacer
As part of the European Chip Act, CEA-Leti is pioneering a new generation of transistors using FDSOI architecture. Our goal is to deliver advanced performance with a strong emphasis on materials and energy efficiency. As we push the limits of planar transistors at 10 nm and 7 nm, we face significant physical challenges, particularly in...
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Fixed term contract
CDD - Ingénieur Design Benchmark H/F
Ce poste a pour objectif d’accompagner le développement de notre activité sur les mémoires non volatiles avancées tout en apportant une expertise Design dans le but d’orienter les choix technologiques. Dans le cadre de vos missions, en interface avec les technologues et les concepteurs, vous : Evaluez les technologies fondeur pour intégration des technologies LETI,...
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Fixed term contract
Ingénieur en caractérisation électrique et fiabilité de dispositifs FDSOI - CDD 36 mois - Grenoble H/F
Nous rejoindre, pour faire quoi ? Dans le cadre du développement des nœuds avancés de la technologie FDSOI qui permettra la réalisation de dispositifs microélectroniques plus performants nous recherchons un(e) ingénieur en caractérisation électrique sous pointes pour rejoindre notre équipe au CEA. Vous travaillerez au travers de projets de recherche et d’équipements de haute technologie à...
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Work-study contract
Développement d'outils IA de classification d'images SEM (H/F)
Cadre et contexte : Les SEM (Scanning Electron Microscope) sont des outils privilégiés pour l’analyse des procédés de fabrication des composants microéléctroniques. En particulier ils sont utilisés au sein du laboratoire de patterning computationnel (LPAC) pour la calibration de modèles de lithographie. Ces modèles sont essentiels pour la correction des effets de proximité (OPC(1), EBPC(2))...
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Fixed term contract
Ingénieur chercheur packaging design & development -microélectronique H/F
Le packaging de composants et systèmes microélectroniques constitue une étape clé pour rapprocher nos innovations des usages applicatifs permettant de relever les défis sociétaux auxquels nous sommes confrontés. Relevons les challenges ensemble : nous recherchons un(e) ingénieur(e) chercheur pour concevoir et développer le packaging de nos composants et systèmes microélectroniques. Au sein du LETI, le...
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Fixed term contract
CDD - Ingénieur chercheur pour le CMOS avancé H/F
Nous rejoindre, pour quoi faire ? Vous aspirez contribuer au développement de dispositifs CMOS avancés, dans un environnement industriel à la pointe ? Ce poste vous place au cœur d’une collaboration étroite entre le CEA-LETI et STMicroelectronics Crolles, avec une présence majoritaire sur le site de notre partenaire. Concrètement, vos missions seront de : Piloter...
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phD
Long-term and non-invasive plant monitoring using MIR spectroscopy
The LCO (french acronym for Optical Sensors Laboratory) develops innovative Silicium integrated photonic components (optical sources, waveguides, photodetectors, etc), sensors, and eventually systems. From upstream technological research to industrial transfers, those sensors apply in various fields such as environment, health, and security. One of the laboratory research topic is mid-infrared spectroscopy of dense samples, using...
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PostDoc
PeRovskItes based SpectroMetric imagers (PRISM)
For many years, CEA has been involved in the development of semiconductor-based X-ray and gamma-ray spectrometric imagers (20keV-1MeV). The main applications targeted are medical imaging, nuclear, security and astronomical observations. State of the art detectors based on Cadmium Telluride single crystals (Cd(Zn)Te) are efficient but costly and their detection area is limited. In recent years,...
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Fixed term contract
CDD - Ingénieur « device » sur la filière composants de puissance SiC H/F
Dans le cadre de son ambition de faire du Leti le premier institut de recherche technologique à développer des architectures de puissance en SiC sur ligne 200 mm, le laboratoire LAPS renforce son équipe SiC et recrute un ingénieur "device". Votre mission Intégré(e) au laboratoire LAPS, en interaction étroite avec les salles blanches, les laboratoires...
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Permanent contract
Research Engineer in simulation and modeling for microelectronic devices W/M
In collaboration with our technology integration and characterization engineers and technicians, and with integrated circuit design teams—as well as our academic and industrial partners—you will work at the intersection of research and industry. Your role will be to help simulate and model the devices that will soon enable the secure and energy-efficient processing of ever-growing...
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Permanent contract
Ingénieur Chercheur RF systèmes photoniques H/F
Nous rejoindre, pour quoi faire ? Au sein d’un environnement de recherche unique sur une thématique à la pointe de l’innovation, nous comptons sur vous pour prendre en main et développer la thématique des transmissions haut débit en photonique sur Si en apportant une approche systèmes en lien avec nos experts composants ainsi qu’avec nos...
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Fixed term contract
Technicien parc informatique H/F
Vous travaillez en étroite collaboration avec le RSSI (Responsable Sécurité du Système d’information). Vous êtes le gestionnaire de parc et l'interlocuteur privilégié des utilisateurs pour toute question touchant aux besoins informatiques et un relais avec le service informatique du centre. A ce titre vous êtes chargé de : · Des commandes de matériel. · La...
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Fixed term contract
Technicien(ne) supérieur(e) procédé Gravure Plasma, caractérisations associées et étapes de stri H/F
Nous rejoindre, pour quoi faire ? Dans un objectif de continuité de service, vous interviendrez sur le traitement de lots dans la zone gravure et stripping du bâtiment haute technologie du LETI. Vous travaillerez en horaires postés (alternance semaine de matin : 5h - 13h15 / semaine d’après-midi : 13h - 21h15), afin d’assurer la...
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Fixed term contract
CDD - Ingénieur filière mémoire ferroélectrique H/F
Le Laboratoire des Dispositifs pour les Mémoires et le Calcul explore et développe des mémoires non-volatiles innovantes (NVM de type mémoires résistives) et des solutions de calcul en rupture (neuromorphique, calcul dans la mémoire…). Notre laboratoire rassemble des compétences en dispositifs et technologie nano-électronique et conception de circuit pour le calcul et les mémoires embarquées. Dans...
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Fixed term contract
Technicien de recherche en traitement thermique - CDD H/F
En lien étroit avec les techniciens et ingénieurs-chercheurs de l’équipe ainsi que le pilote de la thématique traitement thermique, vous travaillerez en salle blanche, en horaires journée, sur les développements technologiques des procédés de traitements thermiques ultra-courts pour les transistors FD-SOI avancés. Le respect des engagements pris auprès de nos partenaires et tutelles ainsi que...
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Fixed term contract
Ingénieur de recherche en traitement de surface par voie chimique - CDD H/F
En lien étroit avec les techniciens et ingénieurs-chercheurs de l’équipe, et en particulier avec les pilotes de la thématique WET, vous travaillerez en salle blanche, en horaires journée, sur les développements technologiques des procédés de traitement par voie chimique (préparation de surface, gravure chimique, etc.) pour des applications autour des transistors avancés, des dispositifs de...
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Permanent contract
Adjoint opérationnel au Chef de service SPAT H/F
Travaillant en horaires normaux, vous assurerez les missions opérationnelles du Chef de service par délégation. − Vous contribuez à l'organisation et la gestion des compétences et des moyens (effectifs, installations, parc installé), et à la réflexion et à l’élaboration des propositions permettant de préparer les évolutions du service et de l'environnement technique selon les orientations...
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Permanent contract
Chef de projet optique et photonique H/F
Nous rejoindre, pour quoi faire ? Au sein de notre équipe d’experts toniques et engagés, vous gérerez des projets institutionnels et industriels dans le domaine de la photonique s’articulant autour des technologies de communications haut-débit et le calcul hautes performances. Votre rôle consistera à : Réaliser l’analyse de risques du projet puis suivre son évolution ; Valider...
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Fixed term contract
CDD - Ingénieur dispositifs ferroélectriques H/F
Dans le cadre de ce poste, vous travaillez sur des dispositifs ferroélectriques innovants dédiés à la mémoire et au calcul. Notre but est de développer une nouvelle technologie mémoire dense, rapide et endurante pour soutenir les applications émergentes, notamment en Intelligence Artificielle. Votre mission principale consiste à concevoir, caractériser électriquement, optimiser des dispositifs ferroélectriques fabriqués au Leti...
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Fixed term contract
CDD - Ingénieur conception de circuit mémoire H/F
Vous avez envie de contribuer à des avancées technologiques majeures dans un environnement de recherche dynamique et collaboratif ? Rejoignez notre laboratoire multidisciplinaire et participez au développement de circuits mémoire de nouvelle génération au sein d’une équipe d’experts passionnés. Vos principales missions : Concevoir des circuits mémoire innovants, en lien étroit avec les équipes de...
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Fixed term contract
CDD - Ingénieur Filières Imagerie Silicium H H/F
Nous rejoindre, pour quoi faire ? Nous vous proposons d’intégrer un environnement de recherche unique pour une expérience sur une thématique à la pointe de l’innovation. Vous êtes ingénieur(e) dans le domaine de la fabrication microélectronique, et vous souhaitez renforcer vos compétences dans le domaine de la filière et intégration procédé, rejoignez notre équipe pluridisciplinaire...
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phD
Co-Design of Ultra-Compact Integrated Converters Leveraging Solid-State Micro-Batteries
Improving the performance of DC-AC and AC-DC power conversion systems is key to reducing system weight, extending operational autonomy, and enhancing compactness. This PhD project aims to explore novel topologies of integrated power converters by leveraging an emerging component: solid-state micro-batteries. The research will begin with a system-level study of two representative applications — one...
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Fixed term contract
Ingénieur chercheur process intégration microélectronique - CDD 36 mois - Grenoble et Crolles H/F
Nous rejoindre, pour quoi faire ? Pour mener à bien cette mission, nous collaborons étroitement avec notre partenaire historique ST Microelectronics. En binôme avec un ingénieur filière, vous nous aiderez à faire le lien entre les développements imaginés dans les laboratoires du CEA LETI et la possibilité d’intégrer leur réalisation dans les process de ST. En particulier,...
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Fixed term contract
Ingénieur gravure plasma pour la microélectronique H/F
Nous rejoindre, pour faire quoi ? Dans un environnement novateur à la jonction entre recherche et industrie, en étroite collaboration avec nos équipes du LETI (intégration, matériaux, lithographie, caractérisation physico-chimique), ainsi qu’avec nos partenaires industriels et académiques, vous aurez en charge : - Le développement de procédés de gravure le plus écoresponsables...
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Fixed term contract
WIP Manager H/F
Intégré au sein du LLAM, vous aurez pour mission de fluidifier l’avancement des produits dans le WIP (Work In Progress) et de superviser et d’optimiser le flux des produits qui sont en cours de fabrication. Pour cela, vous aurez à : Suivre les produits en cours et les produits en attente de lancement. En particulier, une...
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